Overhead cooling module that mounts directly above the cold aisle, requiring no floorspace. It draws in hot air from the hot aisle, then discharges cool air into the cold aisle where the equipment air inlets are located.
In-the-row cooling module placed directly in line with the rack enclosures, and requires very little floorspace. Air from the hot aisle is drawn in through the rear of the unit, cooled, and then discharged horizontally through the front of the unit into the cold aisle.
Rack cooling module that mounts vertically on or above the IT rack enclosure, requiring no floorspace. It draws hot air from inside the cabinet or from the hot aisle. It then cools the air and discharges it down to the cold aisle.
Liebert XD refrigerant-based cooling modules deliver high-density cooling with highly flexible configurations for floor-mount, rack-mount and ceiling-mount applications.
The Liebert XDA rack fan unit optimizes data center cooling by increasing air flow through densely populated enclosures, past congested cabling; removing hot spots within the enclosure that can threaten the uptime of your critical systems.
Designed to remove barriers to liquid cooling in an air-cooled environment, the Liebert® XDU Coolant Distribution Unit is a liquid-to-air heat exchanger for chip cooling applications that offers easy, cost-effective deployment in any data center. The unit operates without facilities water, allowing you to tap into the benefits of water-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.