Vertiv has developed three Vertiv™ Infrastructure Solutions with Vertiv CoolChip concept designs to support direct-tochip liquid cooling solutions, differentiated in the way that they address the air-cooled architecture portion. Each air-cooled architecture has its own benefits – from flexible perimeter cooling, to room neutral in-row cooling and finally the space-saving rear-door heat exchangers – find which design is the right fit for your data center.
Features
Vertiv™ Cooling infrastructure:• Vertiv™ XDU – Cooling Distribution Unit to manage the entire secondary fluid network and supports an innovative contaminant-free design that ensures the highest water quality while providing essential separation of the primary facility water from the ITE heat load power dense spots• Vertiv™ XDM - Split indoor chiller with integrated pumped refrigerant econimization• Vertiv™ Air Cooling units – High-performance thermal management solutions featuring variety of perimeter cooling units, in-row cooling units or rear-door heat exchangers• Vertiv™ Liquid-cooled Racks - Vertiv racks to secure critical devices and enable high density applications• Vertiv™ rPDUs – to ensure reliable power distribution, with basic, monitored or switched rPDUs• Vertiv™ Row & Rack Manifolds - to provide common connection points between Cold Plates within servers and the Vertiv XDU• Integrated Secondary Fluid Network• Overhead Busway & Cable Distribution• Auxiliary systems, as option• Vertiv™ Environet™ Alert real-time monitoring and visualization for critical infrastructure, as option
Benefits
• Completely prefabricated AI direct-to-chip cooled data centers• 100+ kW/rack; air-to-liquid cooling ratio: 5% - 30% Air vs 70% - 95% Liquid• Complex pipework and power train is fully prefabricated• Skidded solutions possible for quick repurposing of existing space• Greatly reduced on-site deployment and commissioning complexity